发明名称 PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION DEVICE
摘要 A plasma CVD(chemical vapor deposition) apparatus is provided to determine the state of a vacuum chamber and to reduce loss when the inside of the vacuum chamber fluctuates by monitoring the variation of resistance of a ground plate in performing a deposition process on a substrate. A space in which a thin film is deposited on a substrate(170) is formed in a vacuum chamber(100). A matching box(110) supplies power to an electrode formed in the vacuum chamber. The power supplied to the electrode is circulated by a ground part(160). A check part(200) checks the variation of the circulated power and the fluctuation of the resistance value of the ground part in depositing a thin film on the substrate and determines and displays the state of the vacuum chamber. The check part includes a conversion part for converting the power supplied by the matching box and a display part for checking and displaying the power converted by the conversion part.
申请公布号 KR20080001524(A) 申请公布日期 2008.01.03
申请号 KR20060059999 申请日期 2006.06.29
申请人 LG.PHILIPS LCD CO., LTD. 发明人 KIM, TAE HYUNG
分类号 H01L21/205 主分类号 H01L21/205
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