| 摘要 |
A semiconductor device comprises a board, a first semiconductor storage device placed on the board, and a second semiconductor storage device placed on the board. Each of the first and second semiconductor storage devices has a first pad for inputting a chip enable signal, a second pad for inputting a write enable signal, a third pad for inputting an output enable signal, a fourth pad for inputting an address signal, and a fifth pad for inputting data. The first semiconductor storage device has a sixth pad which is electrically connected to the first pad of the second semiconductor device, and the second semiconductor storage device has a seventh pad which is electrically connected to the first pad of the first semiconductor device.
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