A bellows type vertical micro-contact probe is provided to suppress concentration of stress by using a structure having a shape of bellows. A micro-contact probe is used for performing an electrical test for a semiconductor chip. The micro-contact probe has a shape of bellows not to generate concentration of stress in a compressing process. The micro-contact probe is formed by connecting micro-contact probes having a plurality of shapes of bellows in parallel to each other. A tip is protruded from an end of the micro-contact probe. The tip of the micro-contact probe comes in contact with an electrode pad of the semiconductor chip. The tip is oriented to one side instead of a center of the end of the micro-contact probe.
申请公布号
KR20080001376(A)
申请公布日期
2008.01.03
申请号
KR20060059791
申请日期
2006.06.29
申请人
KOREA INSTITUTE OF MACHINERY & MATERIALS
发明人
KIM, JUNG YUP;LEE, HAK JOO;CHOI, HYUN JU;MOON, SUNG WOOK;PARK, JUN HYUB