| 摘要 |
A semiconductor package and a method for manufacturing a stacked semiconductor package using the same are provided to improve mounting density by stacking two semiconductor chips, connecting directly each printed circuit board to each semiconductor chip, and connecting electrically two semiconductor chips to each other. A first and a second semiconductor chips(100a,100b) include upper surfaces on which bumps are arranged, lower surfaces facing the upper surfaces, lateral surfaces for connecting the upper and lower surfaces to each other. A stacked substrate(120) is arranged between the first and the second semiconductor chips and includes a first surface on which the lower surface of the first semiconductor chip is attached, a second surface on which the lower surface of the second semiconductor chip is attached, and a lateral surface for connecting the first and second surfaces to each other. A first printed circuit board(130) is arranged on the upper surface of the first semiconductor chip and is electrically connected to the bumps. A second printed circuit board(140) is arranged on the upper surface of the second semiconductor chip and is electrically connected to the bumps. A guide clamp(150) is formed to cover partially the first and second printed circuit boards in order to connect electrically the first and second printed circuit boards to each other.
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