ELECTRONIC DEVICE HAVING A METAL PAD STRUCTURE AND METHOD OF FABRICATION THEREOF

摘要

An electronic device having a metal pad structure and a method for fabricating the same are provided to prevent generation of electrical short circuit between bonding wires formed on metal pad structures. A protective insulating layer(120) is formed on an upper surface of a substrate(100). A plurality of metal pad structures(130a) penetrate the protective insulating layer. The metal pad structures are separated from each other. The metal pad structures have upper surfaces which are positioned at a level higher than a level of the protective insulating layer. A plurality of insulating barrier spacers(140) are formed on sidewalls of the metal pad structures. The insulating barrier spacers have top surfaces which are positioned at a level higher than a level of the metal pad structures.