SIMULATION METHOD FOR EVALUATION MOISTURE ABSORPTION OF SEMICONDUCTOR PACKAGE

摘要

A method for simulating moisture absorption of a semiconductor package is provided to prevent defect caused by moisture absorption in the semiconductor package by modeling each layer of a PCB(Printed Circuit Board), modeling the semiconductor package combining the PCB, a semiconductor chip, and a molding with a FEM(Finite Element Method), and estimating the moisture absorption generated in each interface precisely. A plurality of layers forming the PCB are converted into 3D(Dimensional) solid mode information by drawing the layers with a CAD(Computer-Aided Design) program. The PCB is modeled by layering the solid model information of each layer with an FEM modeling technique. The semiconductor package is modeled through FEM modeling by attaching the semiconductor chip on the PCB, connecting wires to the PCB, and molding the PCB with resin. Simulation for the moisture absorption is performed by considering physical property and specification of the layers forming the semiconductor package.