BALL GRID ARRAY SEMICONDUCTOR CHIP PACKAGE AND TESTING METHOD OF THE SAME

摘要

A BGA(Ball Grid Array) semiconductor chip package and a testing method thereof are provided to carry out various tests from an exterior through a test pad which is exposed outwardly by removing a portion of a protective mold. A substrate(130) has at least one test pad(133) formed on one side of the substrate and plural connection pads(131) electrically connected to the semiconductor chip. Plural solder balls(120) are positioned on the other side of the substrate, and are electrically connected to the connection pads. A protective mold(110) encloses the semiconductor chip and the substrate. A hall is formed on a predetermined region of an upper surface of the protective mold to expose the test pad.