| 摘要 |
One embodiment relates to an encased electrical component board housing system, including an electrical component board encased within a housing. The housing includes an internal chassis, a base, and an intercoupled plurality of panels. The internal chassis supports the electrical component board within an internal region. The panels are selectively intercoupled so as to enclose the internal chassis. The panels are sequentially intercoupled to substantially audibly seal the intercoupling regions between the plurality of panels. The couplings between the panels include translation channels and coupling members extending into the internal chassis. The electrical component board includes audio and/or video functionality. A second embodiment relates to a method for substantially encasing an electrical component board within a housing. The method includes coupling two side panels to the internal chassis, rotatably coupling the front panel to the internal chassis, translating a top panel between two side panels, and translating a rear panel between two side panel.
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