EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL

摘要

Disclosed is an epoxy resin composition containing the following [A], [A'], [B] and [C]. [A] a bisphenol epoxy resin having a glass transition temperature or melting point of not less than 50°C [A'] an epoxy resin which is in a liquid state at 25°C [B] an epoxy resin curing agent [C] at least one block copolymer selected from the group consisting of S-B-M, B-M and M-B-M block copolymers (wherein each block is bound to another block by a covalent bond or by an intermediate molecule bound to one block by a covalent bond and to another block by another covalent bond; block M represents a homopolymer of methyl methacrylate or a copolymer containing at least 50% by weight of methyl methacrylate; block B is incompatible with the block M and has a glass transition temperature of not more than 20°C; and block S is incompatible with the blocks B and M and has a glass transition temperature lower than that of the block B) Also disclosed are a prepreg obtained by impregnating a fiber base material with the epoxy resin composition, and a fiber-reinforced composite material obtained by curing the prepreg.