| 摘要 |
A pattern forming resist and a soft mold manufacturing method using the same are provided to reduce a process cost and increase production yield by using soft lithography instead of photolithography. A pattern forming resist(305) comprises hydrophilic prepolymer more than 90wt%, photoinitiator of 1-3wt%, and surfactant of 0.01-1wt%. The prepolymer is hydrophilic acrylate prepolymer. The acrylate prepolymer includes one or more of HEA(2-hydroxyethyl acrylate), EGDMA(ethyleneglycol dimethacrylate), EGPEA(ethyleneglycol phenyltheracrylate), HPA(hydroxypropyl acrylate) and HPPA(hydroxyphenoxypropyl acrylate). A pattern is formed in an area corresponding a predetermined pattern, which will be desirably formed, through master mold(307) and irradiation of light. |
