FUSE BOX OF SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

摘要

A fuse box of a semiconductor device and a method forming the same are provided to prevent damage of bundles of fuses in a laser cutting process by arranging the fuses in a bypass shape. A first fuse group(140) includes a plurality of first fuses which are arranged in one direction and have a first cutting axis. Each of the first fuses includes a first part having a first fuse pitch, a second part having a second fuse pitch smaller than the first fuse pitch, and a third part for connecting electrically the first part with the second part. A second fuse group(150) includes a plurality of second fuses(150a) which are arranged in one direction and have a second cutting axis. Each of the second fuses includes a first part having a third fuse pitch, a second part having a fourth fuse pitch smaller than the third fuse pitch, and a third part for connecting electrically the first part with the second part. A third fuse group(120) includes a plurality of third fuses(120a). Each of the third fuses includes the first cutting axis or the second cutting axis. Each of the third fuses includes a first pattern having a fifth fuse pitch and a second pattern having a sixth fuse pitch smaller than the fifth fuse pitch to bypass the first fuse or the second fuse.