发明名称 METHOD AND STRUCTURE FOR FORMING STRAINED SI FOR CMOS DEVICES
摘要 A semiconductor device includes a semiconductor substrate having at least one gap, extending under a portion of the semiconductor substrate. A gate stack is on the semiconductor substrate. A strain layer is formed in at least a portion of the at least one gap. The strain layer is formed only under at least one of a source region and a drain region of the semiconductor device.
申请公布号 US2008003735(A1) 申请公布日期 2008.01.03
申请号 US20070854829 申请日期 2007.09.13
申请人 发明人 STEEGEN AN L.;YANG HAINING S.;ZHANG YING
分类号 H01L21/00 主分类号 H01L21/00
代理机构 代理人
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