| 摘要 |
Embodiments of the invention provide an overlay measuring method and a semiconductor fabrication equipment management system adapted to perform the method. In one embodiment, the method comprises setting a map corresponding to a wafer using a measuring apparatus computer and a reference recipe output from a host computer, inputting setup data comprising a setup position and an allowable range corresponding to the setup position to the measuring apparatus computer, recognizing and measuring a position of a center of the wafer, and recognizing and measuring a position of a wafer alignment mark. The method further comprises inputting measurement data comprising a measured position of a wafer overlay mark to the measuring apparatus computer, comparing the measurement data with the setup data, and outputting an interlock control signal from the measuring apparatus computer if the measured position of the wafer overlay mark is outside of the allowable range.
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