发明名称 HEATING ALUMINUM NITRIDE BOARD, HEATER AND PROCESS FOR MANUFACTURING HEATING ALUMINUM NITRIDE BOARD
摘要 <p>A heating aluminum nitride board that by simple construction, attains prevention of any temperature increase of electrode part; a relevant heater; and a process for manufacturing such a heating aluminum nitride board. The heating aluminum nitride board (100) includes high thermal conduction portion (110) having a relatively high thermal conductivity and low thermal conduction portion (120) having a relatively low thermal conductivity. The high thermal conduction portion (110) is disposed in a planar region to be provided with at least one portion of heat generator. The low thermal conduction portion (120) is disposed in a planar region to be provided with at least one portion of electrode. There is provided ceramic heater (1) including heating aluminum nitride board (10); heat generation layer (20) laid in high thermal conduction portion (11); and electrode layer (30) laid in low thermal conduction portion (12). The low thermal conduction portion (120) is formed by, in an oxidizing atmosphere, partially oxidizing an aluminum nitride board to thereby provide a portion containing aluminum oxide in the aluminum nitride board.</p>
申请公布号 WO2008001579(A1) 申请公布日期 2008.01.03
申请号 WO2007JP61164 申请日期 2007.06.01
申请人 A.L.M.T.CORP.;ISHIDU, SADAMU;HIROSE, YOSHIYUKI;NARITA, MASASHI;TSUZUKI, YASUSHI 发明人 ISHIDU, SADAMU;HIROSE, YOSHIYUKI;NARITA, MASASHI;TSUZUKI, YASUSHI
分类号 G03G15/20;H05B3/10;H05B3/00;H05B3/16;H05B3/20 主分类号 G03G15/20
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