| 摘要 |
An apparatus for coating photoresist is provided to allow control of the ejection rate of photoresist, thereby maintaining the amount of photoresist sprayed from a spraying nozzle, and to realize a uniform coating layer thickness. An apparatus for coating photoresist comprises: a bottle in which photoresist is received; a spraying nozzle for spraying the photoresist; and a pump linked to the bottle and a first conveying duct for providing the photoresist received from the bottle to a spraying nozzle through a second conveying duct, wherein the pump controls the spraying rate of the photoresist. The spraying nozzle includes a slit nozzle.
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