| 摘要 |
A peroxide curable silicon adhesive composition comprising a diorganopolysiloxane (A), a polyorganosiloxane (B) comprising R<SUP>1</SUP><SUB>3</SUB>SiO<SUB>0.5 </SUB>unit and SiO<SUB>2 </SUB>unit in a molar ratio of the R<SUP>1</SUP><SUB>3</SUB>SiO<SUB>0.5 </SUB>unit to the SiO<SUB>2 </SUB>unit of from 0.6 to 1.7, a hindered amine compound (C), and an organic peroxide (D), and an adhesive tape thereof are provided. Also provided are an addition-reactive silicon adhesive composition comprising a diorganopolysiloxane (A') having 2 or more alkenyl groups, a polyorganosiloxane (B), a hindered amine compound (C), a polyorganosiloxane (E) having SiH group, a retarder (F), and a platinum catalyst (G), and an adhesive tape thereof.
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