| 摘要 |
A light emitting diode is provided to improve reflection efficiency of light and soldering characteristics by plating a mounting area of a light emitting chip with a material having high reflection efficiency. A printed circuit board includes a base plate(101), at least one first electrode(110) formed at one end of the base plate, and at least one second electrode(120) formed at the other end of the base plate. Each of the first and second electrodes includes a first surface, a third surface facing the first surface, and a second surface for connecting the first surface with the third surface. One or more light emitting chips(200) are mounted on the printed circuit board. A molding part(400) is formed to seal the light emitting chips. The first surface includes Ag. The second and third surfaces of the first and second electrodes include Au or Sn. |
