Kompaktes Leistungshalbleitermodul mit Verbindungseinrichtung

摘要

A lower conductive layer, connected to an upper conductive layer, has contacts that provide control connection to a printed circuit board (7). A film composite, formed from upper and lower conductive layers, has a first film section disposed between the first contact formed as spot-welded joint and second contact and a second film section disposed between the third contact (604) and fourth contact (606). The first and second film sections are arranged in the guide sections (30) of a housing (3). The third and fourth contacts have parallel area normals.