发明名称 |
Method of manufacturing capacitor-embedded low temperature co-fired ceramic substrate |
摘要 |
A method of manufacturing a capacitor-embedded low temperature co-fired ceramic substrate, the method including: manufacturing a capacitor part by firing a deposition including at least one high dielectric ceramic sheet to form a capacitor part; providing a plurality of low temperature co-fired green sheets each having at least one of a conductive pattern and a conductive via hole thereon; forming a low temperature co-fired ceramic deposition by depositing the low temperature co-fired green sheets to embed the capacitor part in the low temperature co-fired ceramic deposition, the embedded capacitor part connected to the one of conductive pattern and conductive via hole of an adjacent one of the green sheets; and firing the low temperature co-fired ceramic deposition having the capacitor part embedded therein. The capacitor-embedded low temperature co-fired ceramic substrate may be beneficially employed in various types of capacitor part such as a deposited chip capacitor and a capacitor layer structure.
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申请公布号 |
US2008000061(A1) |
申请公布日期 |
2008.01.03 |
申请号 |
US20070819897 |
申请日期 |
2007.06.29 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JEONG SEUNG GYO;CHOI YONG SEOK;HONG KI PYO |
分类号 |
H01G9/00 |
主分类号 |
H01G9/00 |
代理机构 |
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代理人 |
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主权项 |
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