WAFER LEVEL CHIP PACKAGING

摘要

Packaged microelectronic elements are provided (112). In an exemplary embodiment, a microelectronic element (132) having a front face (26) and a plurality of peripheral edges (119) bounding the front face has a device region (14) at the front face and a contact region (16) with a plurality of exposed contacts (18) adjacent to at least one of the peripheral edges (119). The packaged element may include a plurality of support walls (32) overlying the front' face (26) of the microelectronic element (132) such that a lid (40) can be mounted to the support walls (32) above the microelectronic element (132). For example, the lid (40) may have an inner surface (22) confronting the front face (26). In a particular embodiment, some of the contacts (18) can be exposed beyond edges (140) of the lid (40).