HEAT CURABLE RESIN COMPOSITION, AND MOUNTING METHOD AND REPARING PROCESS FOR CIRCUIT BOARD USING THE HEAT CURABLE COMPOSITION

摘要

This invention provides a resin composition which can prevent damage to a low-heat resistant component upon heating in a process for mounting electronic components on a circuit board. There are also provided a method for easily repairing circuit boards, which have been determined as off-specification products in the mounting process, and a method for separating and collecting useful boards and/or electronic components from circuit boards, which have been determined as off-specification products in the mounting process. The resin composition comprises, based on (A) 100 parts by weight of epoxy resin, (B) 30 to 200 parts by weight of a thiol curing agent, (C) 5 to 200 parts by weight of an organic-inorganic composite insulating filler and (D) 0.5 to 20 parts by weight of an imidazole curing accelerator . In the collecting method, a part or the whole of the circuit board in the mounting process is heated in the temperature range of the glass transition point of the resin composition to 110ºC to soften the resin composition,and electronic components are separated and collected from the circuit board.