FLIP CHIP HAVING BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

摘要

A flip chip having a bump structure and a method for manufacturing the same are provided to attach a bump on a substrate without collapsing or changing the bump in a package assembling process. A conductive pad(120) is formed on a predetermined part of a semiconductor substrate. A barrier layer(130) is formed on a surface of the conductive pad. A bump structure(150) is formed on an upper part and a sidewall of the conductive pad. A protrusive part is formed at each of lower edges of the bump structure. The protrusive part corresponds to 1/10 to 1/100 of the total width of the bump structure. The bump structure includes a preliminary bump formed on a surface of the barrier layer and a main bump formed on the preliminary bump. The preliminary bump is extended to the outside in comparison with the main bump.