LIGHT EXPOSURE DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A semiconductor exposure apparatus is provided to minimize a pattern error due to a focusing error by removing easily contaminants attached on a rear surface of a wafer. A spin unit(10) includes a spin chuck(15). A wafer(40) is loaded on the spin chuck. An imaging unit(20) is positioned at a lower end of the spin chuck in order to sense a position of foreign materials attached on a rear surface of the wafer. An air blowing unit(30) is positioned at a lower end of the spin chuck in order to remove the foreign materials from the rear surface of the wafer. A control unit receives position information of the foreign materials and transfers the position information of the foreign materials to the air blowing unit.