SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

摘要

A substrate processing method and a substrate processing apparatus are provided to effectively prevent a breakdown of a pattern during a drying process by completely removing a solution component between patterns. Most of solution is removed from a substrate surface except for a portion of solution. A mixture solution containing first liquid and an organic resolvent component is supplied to a substrate surface, which is arranged in a parallel position. The first solution contains completely or mainly the same component as the solution, which is attached to the substrate surface. The organic resolvent component decreases a surface tension of the solution. The remaining solution component is replaced with the mixture solution. The mixture solution is removed from the substrate surface, and the substrate surface is dried. A volume of the organic resolvent component with respect to the mixture solution is smaller than 50 %.