| 摘要 |
Silver alloys are employed to solder or braze a semi-conductor device electrode to a heat-sink. The electrode comprises a tungsten element covered by at least one layer of copper and at least one layer of silver or gold all electrolytically applied, the layering depending on the solder used. For hard soldering, or brazing solders suggested are Cu, Au, Ag and alloys thereof possibly containing P, Si, Ge, Pb or Sn, for example, (a) Ag 60%, Cu 30%, Sn 10%, (b) Ag 96%, Pb 2%, Si 2%. For soft soldering alloys suggested are of Sn and Pb with other additions such as Ag, for example, (a) Pb 40%, Sn 60%, (b) Pb 88%, Sn 10%, Ag 2%, (c) Pb 95%, Sn 5%. |
