INK COMPOSITION AND METALLIC MATERIAL

摘要

Disclosed is an ink composition which enables to form a metallic material exhibiting excellent adhesion to a base while being free from ion migration. Specifically disclosed is an ink composition obtained by dispersing fine particles of metallic copper and/or copper hydride and fine particles of silver oxide or metallic silver in a water-insoluble organic liquid. This ink composition has a solid content concentration of 10-80% by mass, and contains 5-90 parts by mass of the metallic copper and/or copper hydride fine particles and 10-95 parts by mass of the silver oxide or metallic silver fine particles per 100 parts by mass of the total solid content in the ink composition.