发明名称 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
摘要 |
A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump. A tip of a second wire formed in the shape of a ball is bonded to the bump by using a tool in a state in which at least a part of the tip is superposed on the first wire. A part of the first wire which is not deformed by bonding is prevented from being deformed by the tip of the second wire and the tool.
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申请公布号 |
US7314818(B2) |
申请公布日期 |
2008.01.01 |
申请号 |
US20060410129 |
申请日期 |
2006.04.25 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
TAKAHASHI TAKUYA;TOMIMATSU HIROYUKI |
分类号 |
H01L21/44;H01L25/18;H01L21/60;H01L21/607;H01L23/485;H01L23/495;H01L25/065;H01L25/07 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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