发明名称 Capacitor below the buried oxide of SOI CMOS technologies for protection against soft errors
摘要 Disclosed is a semiconductor structure that incorporates a capacitor for reducing the soft error rate of a device within the structure. The multi-layer semiconductor structure includes an insulator-filled deep trench isolation structure that is formed through an active silicon layer, a first insulator layer, and a first bulk layer and extends to a second insulator layer. The resulting isolated portion of the first bulk layer defines the first capacitor plate. A portion of the second insulator layer that is adjacent the first capacitor plate functions as the capacitor dielectric. Either the silicon substrate or a portion of a second bulk layer that is isolated by a third insulator layer and another deep trench isolation structure can function as the second capacitor plate. A first capacitor contact couples, either directly or via a wire array, the first capacitor plate to a circuit node of the device in order to increase the critical charge, Qcrit, of the circuit node.
申请公布号 US7315075(B2) 申请公布日期 2008.01.01
申请号 US20050905906 申请日期 2005.01.26
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 AITKEN JOHN M;CANNON ETHAN H.;OLDIGES PHILIP J.;STRONG ALVIN W.
分类号 H01L29/00;H01L29/76;H01L29/94;H01L31/062 主分类号 H01L29/00
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