| 发明名称 |
Semiconductor wafer treatment method, semiconductor wafer inspection method, semiconductor device development method and semiconductor wafer treatment apparatus |
| 摘要 |
A treatment method of a semiconductor wafer includes treating the semiconductor wafer in a first solution having at least one kind of an oxidative acid and an oxidizing agent and treating the semiconductor wafer in a second solution having at least one of HF and NH<SUB>4</SUB>F.
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| 申请公布号 |
US7314766(B2) |
申请公布日期 |
2008.01.01 |
| 申请号 |
US20030706090 |
申请日期 |
2003.11.13 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SUGAMOTO JUNJI;TSUCHIYA NORIHIKO;USHIKU YUKIHIRO;TANZAWA KATSUJIRO |
| 分类号 |
H01L21/00;H01L21/66;H01L21/302;H01L21/306;H01L21/461 |
主分类号 |
H01L21/00 |
| 代理机构 |
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