发明名称 Composition for a bottom-layer resist
摘要 A composition for a bottom-layer resist, having superior anti-refractivity and dry-etch resistance for use in a bi-layer resist process employing a light source at a wavelength of 193 nm or below, is disclosed. The composition for the bottom-layer resist contains a polymer represented by formula 1: In formula 1, R is hydrogen or a methyl group, m/(m+n) is about 0.5 to about 1.0 and n/(m+n) is 0 to about 0.5.
申请公布号 US7314702(B2) 申请公布日期 2008.01.01
申请号 US20030726477 申请日期 2003.12.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE SUNG-HO;HONG JIN;WOO SANG-GYUN
分类号 G03F7/00;G03F7/039;G03F7/09;H01L21/027 主分类号 G03F7/00
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