发明名称 Semiconductor device and method of manufacturing the same
摘要 An insulating film provided below a floating gate electrode includes a first insulating film located at both end portions below the floating gate electrode, and a second insulating film sandwiched between the first insulating films and located in a middle portion below the floating gate electrode. The first insulating film and the second insulating film are formed in separate steps, and the first insulating film is thicker than the second insulating film. With this structure, when an insulating film is provided between the floating gate electrode and a silicon substrate to have a thickness more increased at its end portion than at its middle portion, the thickness can be increased more freely and a degree of the increase can be controlled more readily.
申请公布号 US7315061(B2) 申请公布日期 2008.01.01
申请号 US20050209847 申请日期 2005.08.24
申请人 RENESAS TECHNOLOGY CORP. 发明人 TERAUCHI TAKASHI
分类号 H01L29/792 主分类号 H01L29/792
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