发明名称 Fingerprint sensor package
摘要 A fingerprint sensor package includes an LSI chip for reading a fingerprint, a substrate having an external connection terminal and to which the LSI chip is fixed, and a chip fixing mechanism for fixing the LSI chip in a state where the LSI chip is deformed so as to form a curved surface, provided between the LSI chip and the substrate.
申请公布号 US7315070(B2) 申请公布日期 2008.01.01
申请号 US20040960990 申请日期 2004.10.12
申请人 FUJITSU LIMITED 发明人 OKADA AKIRA;SATO MITSURU;SATO HIDEO
分类号 G06T1/00;H01L29/84;G06K9/00;H01L23/12;H04N1/028 主分类号 G06T1/00
代理机构 代理人
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