发明名称 |
Carrier-free semiconductor package and fabrication method thereof |
摘要 |
A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts formed thereon; mounting at least one chip on the carrier; electrically connecting the chip to the electrical contacts via a plurality of bonding wires; forming a coating layer on each of the electrical contacts to encapsulate a bonded end of each of the bonding wires on the electrical contacts; performing a molding process to form an encapsulant for encapsulating the chip, the bonding wires and the electrical contacts; and removing the carrier, such that bottom surfaces of the electrical contacts are exposed from the encapsulant. This obtains a semiconductor package not having a carrier, and the coating layers can enhance adhesion between the electrical contacts and the encapsulant.
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申请公布号 |
US7314820(B2) |
申请公布日期 |
2008.01.01 |
申请号 |
US20050042939 |
申请日期 |
2005.01.24 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
LIN YU-WEI;TANG FU-DI;LI CHUN-YUAN;TSAI TERRY;HO YU-TING |
分类号 |
H01L21/44;H01L21/48;H01L21/50;H01L23/48;H01L23/495;H01L23/498;H01L23/52 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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