发明名称 CONTAINER PAPER BOARD FOR CONTAINING ELECTRONICS CHIPS
摘要 <p>A CONTAINER PAPER BOARD FOR CONTAINING ELECTRONIC CHIP, APPROPRIATE FOR HIGH SPEED CHIP-TAKING UP PROCEDURE, INCLUDES A BASE PAPER BOARD (2), A TOP COVER TAPE (3) HEAT BONDED TO A FRONT SURFACE OF THE BASE PAPER BOARD AT TWO STRIPE PATTERNED AREA (7,8) WITH A WIDTH OF 0.5 + 0.15 MM AND A BOTTOM COVER TAPE (6), AND HAS A PLURALITY OF CHIP-CONTAINING PERFORATIONS AND SPROCKET PERFORATIONS, WHEREIN THE BASE PAPER BOARD FRONT SURFAEC HAS A CENTER-LINE MEAN ROUGHNESS (Ra) OF 2.5 TO 4.0 µM, THE AVERAGE PEELING STRENGTH ( P ave) BETWEEN THE BASE PAPER BOARD AND THE TOP COVER TAPE IS 0.1 TO 0.6N AND THE PEELING STRENGTH SIGNAL TO NOUSE (SN) RATIO [ ( Pmax - Pmin) /Pave] IS 0.40 OR LESS.(FIG 1)</p>
申请公布号 MY134656(A) 申请公布日期 2007.12.31
申请号 MY2004PI00443 申请日期 2004.02.12
申请人 OJI PAPER CO., LTD. 发明人 TAKETO OKUTANI;MANABU YAMAMOTO;KANAKO INAKI
分类号 B42D15/02;B65D73/02;B42D15/08;B65D27/00;B65D85/86;D21H27/00;H05K13/02 主分类号 B42D15/02
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