| 发明名称 |
ELECTRONIC DEVICES HAVING METALLURGIES CONTAINING COPPER-SEMICONDUCTOR COMPOUNDS |
| 摘要 |
SILICON AND GERANIUM CONTAINING MATERIALS ARE USED AT SURFACE OF CONDUCTORS IN ELECTRONIC DEVICES. SOLDER CAN BE FLUXLESSLY BONDED AND WIRES CAN BE WIRED BONDED TO THESE SURFACES. THESE MATERIAL ARE USED AS A SURFACE COATING FOR LEAD FRAMES FOR PACKAGING INTEGRATED CIRCUIT CHIPS. THESE MATERIALS CAN BE DECAL TRANSFERRED ONTO CONDUCTOR SURFACES OR ELECTROLESSLY OR ELECTROLYTICALLY DISPOSED THEREON.(FIG. 1) |
| 申请公布号 |
MY134716(A) |
申请公布日期 |
2007.12.31 |
| 申请号 |
MY1993PI00721 |
申请日期 |
1993.04.21 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MICHAEL JOHN BRADY;SHELDON COLE RIELEY;GEORGE FREDERICK WALKER;CURTIS EDWARD FARRELL;SUNG KWON KANG;JEFFREY ROBERT MARINO;DONALD JOSEPH MIKALSEN;PAUL ANDREW MOSKOWITZ;EUGENE JOHN O'SULLIVAN;TERRENCE ROBERT O'TOOLE;SAMPATH PURUSHOTHAMAN |
| 分类号 |
H01L21/60;H01L23/485;C23C18/50;C25D3/54;H01L21/288;H01L21/603;H01L21/768;H01L23/495;H01L23/498;H01L23/532 |
主分类号 |
H01L21/60 |
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