| 摘要 |
A CHEMICAL MECHANICAL POLISHING SLURRY COMPRISING A FILM FORMING AGENT, AN OXIDIZER SUCH AS UREA HYDROGEN PEROXIDE, A COMPLEXING AGENT SUCH AS AMMONIUM OXALATE OR TARTARIC ACID, AN ABRASIVE, AND AN OPTIONAL SURFACTANT. ALSO DISCLOSED IS A METHOD FOR USING THE CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION TO REMOVE COPPER ALLOY, TITANIUM, AND TITANIUM NITRIDE CONTAINING LAYERS FROM A SUBSTRATE.(FIG 1) |
