发明名称 NOVEL COMPOSITE FOIL, PROCESS FOR PRODUCING THE SAME AND COPPER-CLAD LAMINATE
摘要 A COMPOSITE FOIL (21) COMPRISING A CONDUCTIVE CARRIER (22), AN ORGANIC RELEASE LAYER (23) COATING A SURFACE OF THE CONDUCTIVE CARRIER (22), AND A CONDUCTIVE PARTICLE LAYER (24) FORMED ON THE ORGANIC RELEASE LAYER (23). A PROCESS FOR PRODUCING A COMPOSITE FOIL (21), COMPRISING THE STEPS OF FORMING AN ORGANIC RELEASE LAYER (23) ON A SURFACE OF A CONDUCTIVE CARRIER (22), AND ELECTRODEPOSITING A CONDUCTIVE PARTICLE LAYER (24) ON THE ORGANIC RELEASE LAYER (23).A COPPER-CLAD LAMINATE COMPRISING THE ABOVE COMPOSITE FOIL (21) LAMINATED TO A BASE MATERIAL (31). A COPPERCLAD LAMINATE COMPRISING THE ABOVE COMPOSITE FOIL (21) LAMINATED TO A BASE MATERIAL, HAVING ONLY THE CONDUCTIVE CARRIER (22) REMOVED THEREFROM. THUS, THERE ARE PROVIDED A COMPOSITE FOIL (21) FOR PRINTED WIRING BOARD PRODUCTION FROM WHICH A COPPER-CLAD LAMINATE ENABLING LASER PERFORATING WITHOUT FORMING BURRS EVEN AT LOWER LASER POWER AND FURTHER ENABLING FORMING FINE-PITCH WIRING PATTERNS (33) CAN BE PRODUCED,A PROCESS FOR PRODUCING THE COMPOSITE FOIL (21) AND A COPPER-CLAD LAMINATE PRODUCED THEREFROM.(FIG 2)
申请公布号 MY134297(A) 申请公布日期 2007.12.31
申请号 MYPI9904521 申请日期 1999.10.20
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 TAKASHI KATAOKA;YUTAKA HIRASAWA;TAKUYA YAMAMOTO;KENICHIRO IWAKIRI;TSUTOMU HIGUCHI
分类号 H01B1/12;H05K3/02;B32B15/08;H05K1/05;H05K3/00;H05K3/18;H05K3/38;H05K3/46 主分类号 H01B1/12
代理机构 代理人
主权项
地址