发明名称 |
NOVEL COMPOSITE FOIL, PROCESS FOR PRODUCING THE SAME AND COPPER-CLAD LAMINATE |
摘要 |
A COMPOSITE FOIL (21) COMPRISING A CONDUCTIVE CARRIER (22), AN ORGANIC RELEASE LAYER (23) COATING A SURFACE OF THE CONDUCTIVE CARRIER (22), AND A CONDUCTIVE PARTICLE LAYER (24) FORMED ON THE ORGANIC RELEASE LAYER (23). A PROCESS FOR PRODUCING A COMPOSITE FOIL (21), COMPRISING THE STEPS OF FORMING AN ORGANIC RELEASE LAYER (23) ON A SURFACE OF A CONDUCTIVE CARRIER (22), AND ELECTRODEPOSITING A CONDUCTIVE PARTICLE LAYER (24) ON THE ORGANIC RELEASE LAYER (23).A COPPER-CLAD LAMINATE COMPRISING THE ABOVE COMPOSITE FOIL (21) LAMINATED TO A BASE MATERIAL (31). A COPPERCLAD LAMINATE COMPRISING THE ABOVE COMPOSITE FOIL (21) LAMINATED TO A BASE MATERIAL, HAVING ONLY THE CONDUCTIVE CARRIER (22) REMOVED THEREFROM. THUS, THERE ARE PROVIDED A COMPOSITE FOIL (21) FOR PRINTED WIRING BOARD PRODUCTION FROM WHICH A COPPER-CLAD LAMINATE ENABLING LASER PERFORATING WITHOUT FORMING BURRS EVEN AT LOWER LASER POWER AND FURTHER ENABLING FORMING FINE-PITCH WIRING PATTERNS (33) CAN BE PRODUCED,A PROCESS FOR PRODUCING THE COMPOSITE FOIL (21) AND A COPPER-CLAD LAMINATE PRODUCED THEREFROM.(FIG 2)
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申请公布号 |
MY134297(A) |
申请公布日期 |
2007.12.31 |
申请号 |
MYPI9904521 |
申请日期 |
1999.10.20 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
TAKASHI KATAOKA;YUTAKA HIRASAWA;TAKUYA YAMAMOTO;KENICHIRO IWAKIRI;TSUTOMU HIGUCHI |
分类号 |
H01B1/12;H05K3/02;B32B15/08;H05K1/05;H05K3/00;H05K3/18;H05K3/38;H05K3/46 |
主分类号 |
H01B1/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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