PRINTED CIRCUIT BOARD FOR SEMI-CONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A printed circuit board for a semiconductor package and a method for manufacturing the same are provided to simplify a solder resist forming process and a bump forming process by forming a bump using a metal tool having a specific pattern shape. A method for manufacturing a printed circuit board for a semiconductor package includes the steps of: preparing the printed circuit board for the semiconductor package including a circuit pattern and a pad part mounting a semiconductor and connecting with an outside components(S101); offering a metal tool placed for a pattern to correspond to the pad part, and having a base layer and the pattern formed on the top of the base(S102); attaching the pattern of the metal tool to one side or both sides of the printed circuit board to place the metal tool pattern corresponding to the pad part on the pad part(S103); charging and forming a solder resist layer in a space between the metal tool and the printed circuit board(S104); and patterning the base layer of the metal tool layer and forming a bump(S105).