FABRICATING METHOD OF RIGID FLEXIBLE PRINTED CIRCUIT BOARD

摘要

A method for fabricating a rigid flexible printed circuit board is provided to reduce a thickness of the printed circuit board by forming an inner layer circuit pattern using only a copper foil. A method for fabricating a rigid flexible printed circuit board includes the steps of: forming a coverlay(108) on an inner layer circuit pattern after forming the inner layer circuit pattern on both sides of a flexible copper clad laminate having a polyimide layer(102) and a first copper foil layer; filling a conductive paste in an inner via hole after forming the inner via hole penetrating the coverlay and the polyimide; laminating a dielectric layer(116) and a second copper layer(118) in order on the coverlay and the conductive paste in a rigid zone; forming an outer via hole penetrating the second copper foil layer and the dielectric layer to expose the inner layer circuit pattern formed by the inner via hole; and forming an outer layer circuit pattern having the second copper foil layer, an electroless copper plating layer(124a) and an electro copper plating layer(124b) after forming the electroless copper plating layer and the electro copper plating layer in the inside of the outer via hole and the second copper foil layer.