FLIP CHIP METHOD AND DETACHING METHOD OF IC CHIP USING THIN FILM HEATER FABRICATED ON IC CHIP

摘要

A flip-chip mounting method of a semiconductor chip using a thin film heater formed in a semiconductor chip is provided to simplify a flip-chip mounting process and apparatus and improve thermal efficiency by applying current to a thin film heater formed in a semiconductor chip to reflow a solder bump of the semiconductor chip so that the semiconductor chip is flip-chip mounted on a substrate. A thin film heater(12) is formed on a semiconductor chip(11) not packaged by epoxy or ceramic. A solder bump(13) of the semiconductor chip is arranged on a metal terminal of a substrate(14). The solder bump of the semiconductor chip is reflowed by the heat generated by applying current to the thin film heater so that the semiconductor chip is flip-chip mounted on the substrate. The substrate for flip-chip mounting or demounting the semiconductor chip can be a polymer board like a PCB, an FPCB(flexible printed circuit board) and an COF(chip on film) board, or a glass board of an LCD panel and an OLED panel.