发明名称 |
METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD |
摘要 |
A method of packaging a multi-tier wire bonded semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors per layer providing interconnection between s elements in the multi-tier wire bonded semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device. |
申请公布号 |
SG137863(A1) |
申请公布日期 |
2007.12.28 |
申请号 |
SG20070180748 |
申请日期 |
2005.06.22 |
申请人 |
KULICKE AND SOFFA INDUSTRIES, INC. |
发明人 |
BATISH RAKESH |
分类号 |
|
主分类号 |
|
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|