| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology capable of downsizing a semiconductor device. <P>SOLUTION: This semiconductor device has a main face 100a (first main face) and a main face 100b (second main face) located on the opposite side of the main face 100a. The device comprises a conductive layer 1 (first conductive layer) and a conductive layer 2 (second conductive layer) formed so as to expose a part thereof to the main face 100b side; an LED chip 4 (light emitting semiconductor chip) connected electrically to the main face 1a of the conductive layer 1; a wire 5 (conductive member) for electrically connecting the LED chip 4 to the conductive layer 2; and a light-transmitting sealing body 3 for sealing the conductive layer 1, the conductive layer 2, the wire 5, and the LED chip 4. With this structure, a condenser lens is not formed on the main face 100a, and the conductive layer 1, the conductive layer 2, the wire 5 and the LED chip 4 are sealed by only the sealing body 3. <P>COPYRIGHT: (C)2008,JPO&INPIT |
