| 摘要 |
PROBLEM TO BE SOLVED: To improve line accommodation of a printed circuit board including a bypass capacitor for absorbing noise due to an IC component. SOLUTION: A slave substrate 30 on which the bypass capacitor 31 is mounted is packaged on a soldered surface 10b opposite to a component surface 10a of a master substrate 10 on which the IC component 20 is packaged. One of packaging terminals 34 to be connected with a power supply line 32 of the slave substrate 30 is connected with a power supply pin of the IC component 20 via the master substrate 10, and the other is connected with a power supply line 15 of the master substrate 10, thereby improving noise absorbency of the capacitor 31. A signal line 17 is routed on the soldered surface 10b except the connection of the packaging terminal 34 of the slave substrate 30, thereby allowing line accommodation to be improved. COPYRIGHT: (C)2008,JPO&INPIT
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