发明名称 |
THERMALLY DISAPPEARING RESIN PARTICLE |
摘要 |
It is intended to provide a thermally disappearing resin particle which can be decomposed at a low temperature and in a short time and gives a sintered body in which deformation or crack does not occur when being used as a binder or a weight-reducing material for a ceramic; a thermally disappearing hollow resin particle; a process for producing the thermally disappearing hollow resin particle; a ceramic composition which can be degreased and sintered at a low temperature in a short time and can give a molded body with high porosity without occurrence of deformation or crack even when a pore forming material is used in a large amount; and a process for producing a porous ceramic filter. The invention is directed to the thermally disappearing resin particles each of which contains a polyoxyalkylene resin and in which a portion corresponding to 10 % by weight or more of the whole particles disappears within 1 hour when the particles are heated to a predetermined temperature in the range from 100 to 300°C. |
申请公布号 |
KR20070121801(A) |
申请公布日期 |
2007.12.27 |
申请号 |
KR20077024287 |
申请日期 |
2005.12.13 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
OOMURA TAKAHIRO;NAGATANI NAOYUKI;INAOKA MIKI;YAMAUCHI HIROSHI |
分类号 |
C08G65/48;C04B35/632;C08F290/06;C08G65/22 |
主分类号 |
C08G65/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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