| 摘要 |
An apparatus and a method of an LED(Light-Emitting Diode) multi-layer metals primary electrode are provided to produce a metal electrode by depositing directly a multi-layer metal thin film and attaching a magnetic unit and a mask on an epitaxial wafer using a specially designed carrier. An epitaxial wafer is cleaned(a) and is installed on a carrier, and a magnetic mask including a plurality of contact holes is aligned on the wafer(b). A plurality of metal sources are provided to be overlapped on the epitaxial wafer by transmitting a multi-layer metal electrode sequentially to the contact holes using a metal deposition method(c). The magnetic mask and the carrier are removed(d).
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