| 摘要 |
PROBLEM TO BE SOLVED: To prevent a molded product from varying in quality with the metering of powder resin kept correct, by the method wherein powder resin is piled up on the upper surface of a substrate outside of a metal mold, turned into gel through a pre-heating treatment, and introduced into the metal mold together with the substrate; whereby powder resin is restrained from scattering off in the metal mold, the products are prevented from being contaminated, and furthermore even voids are filled up with powder resin when the powder resin is leveled off. SOLUTION: The resin molding method comprises processes of supplying a prescribed amount of powder resin 4 onto the top surface of a substrate 1 where an IC chip 2 and a connection terminals 3 bonded thereto are assembled, turning the powder resin 4 into gel by pre-heating it at temperatures of 180 to 250°C, introducing the substrate 1 into the metal mold B, and carrying out a molding process through vacuum pressurization casting. COPYRIGHT: (C)2008,JPO&INPIT
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