| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid jetting head capable of easily and electrically connecting a driving circuit and a piezoelectric element, reducing the manufacturing cost and preventing defect of connection from being generated, and to provide a liquid jetting apparatus. SOLUTION: An IC chip 200 has a first pad part 205 provided on the opposite side face to a flow path forming substrate 10 side, connected with external wiring 204 and electrically connected with a driving circuit 201, and a second pad part 208 provided on the flow path forming substrate 10 side, and connected with an electrode of a pressure generating element 300, and has a through-electrode 202 provided by passing through a semiconductor substrate 203 and connected with the second pad part 208. At least an individual electrode of the pressure generating element 300 is electrically connected with the driving circuit 201 through the through-electrode 202. COPYRIGHT: (C)2008,JPO&INPIT
|
