发明名称 |
FILM FORMING APPARATUS AND FILM FORMING METHOD |
摘要 |
<p>A film forming apparatus is provided with a chamber which partitions a processing space for performing film forming process to a substrate; a stage arranged in the chamber for placing the substrate; a substrate heating means arranged on the stage for heating the substrate; a shower head which is arranged to face the stage and has many gas jetting holes; a gas supplying mechanism for supplying the chamber with a processing gas through the shower head; a cooling means arranged above the shower head for cooling the shower head; and a shower head heating means arranged above the cooling means for heating the shower head through the cooling means.</p> |
申请公布号 |
WO2007148692(A1) |
申请公布日期 |
2007.12.27 |
申请号 |
WO2007JP62328 |
申请日期 |
2007.06.19 |
申请人 |
TOKYO ELECTRON LIMITED;KAKEGAWA, TAKASHI |
发明人 |
KAKEGAWA, TAKASHI |
分类号 |
C23C16/455;H01L21/28;H01L21/285 |
主分类号 |
C23C16/455 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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