发明名称 FILM FORMING APPARATUS AND FILM FORMING METHOD
摘要 <p>A film forming apparatus is provided with a chamber which partitions a processing space for performing film forming process to a substrate; a stage arranged in the chamber for placing the substrate; a substrate heating means arranged on the stage for heating the substrate; a shower head which is arranged to face the stage and has many gas jetting holes; a gas supplying mechanism for supplying the chamber with a processing gas through the shower head; a cooling means arranged above the shower head for cooling the shower head; and a shower head heating means arranged above the cooling means for heating the shower head through the cooling means.</p>
申请公布号 WO2007148692(A1) 申请公布日期 2007.12.27
申请号 WO2007JP62328 申请日期 2007.06.19
申请人 TOKYO ELECTRON LIMITED;KAKEGAWA, TAKASHI 发明人 KAKEGAWA, TAKASHI
分类号 C23C16/455;H01L21/28;H01L21/285 主分类号 C23C16/455
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