| 摘要 |
<p>Provided is a method for manufacturing laminated ceramic electronic components, by which structural defects, such as peeling between a dielectric ceramic layer and an internal electrode, can be reduced. The method for manufacturing laminated ceramic electronic components is provided with a step of preparing a dielectric ceramic green sheet (112); a step of arranging a first foil-like metal film as internal electrodes (13, 14) on the dielectric ceramic green sheet (112); a step of manufacturing a raw laminated body (111) by laminating a plurality of dielectric ceramic green sheets (112) having the internal electrodes by permitting one end of each of the internal electrodes (13, 14) to be alternately exposed from the opposite sides; a step of arranging a second foil-like metal film as external electrodes (15, 16) for connecting the ends of the internal electrodes (13, 14) exposed from the both end surfaces of the raw laminated body (111); and a step of sintering the raw laminated body (111) whereupon the foil-like external electrodes (15, 16) are arranged.</p> |
