| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic component module of a constitution where the ratio of a mounting surface on which a mounting component can be mounted in the main surface of a substrate is increased, and where a metal case is positioned easily. SOLUTION: The electronic component module 10 comprises a module main body 12 mounting the mounting component 16 on the substrate 14. The metal case 20 is fitted onto the substrate 14 so as to cover the mounting component 16 of the module main body 12. The metal case 20 is composed of a top plate 22 arranged nearly parallel to the main surface of the substrate 14 and pawls 24 formed at both of the ends of it. Each of the pawls 24 comprises a pawl main body 26 composed of a rectangular part 26a bent from the end edge of the top plate 22 and extending in the direction of the substrate 14, and a holding pawl 26b. Moreover, bent from both of the ends of the rectangular part 26a, abutting parts 28 are formed toward inside of the main surface of the substrate 14. The abutting parts 28 are abutted on one of the main surfaces of the substrate 14, and the holding pawl 26b is soldered to the side face of the substrate 14. COPYRIGHT: (C)2008,JPO&INPIT
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